PART |
Description |
Maker |
FLGA-SD |
Fine Pitch Land Grid Array - Stacked Die
|
STATSCHIP[STATS ChipPAC, Ltd.]
|
NP352-04808 NP352-04811 NP352-04813 NP352-1849-35 |
Fine Ball Grid Array (FBGA, 1.00mm Pitch)
|
Yamaichi Electronics Co., Ltd.
|
NP396-500 |
Shrink Ball Grid Array (1.27mm Pitch)
|
Yamaichi Electronics Co., Ltd.
|
YPKG-C7CG-A7A2DC |
CCGA1272, 37.5 MM X 37.5 MM, 1.0 MM PITCH, 1272 SOLDER COLUMNS, CERAMIC COLUMN GRID ARRAY, DAISY CHAIN PACKAGE
|
Actel Corporation
|
UPD703108GC-8EU-A |
32-BIT, 40 MHz, RISC MICROCONTROLLER, PQFP100 14 X 14 MM, FINE PITCH, PLASTIC, LQFP-100
|
NEC, Corp.
|
UPD703014AYGC-XXX-8EU |
32-BIT, MROM, 20 MHz, MICROCONTROLLER, PQFP100 14 X 14 MM, FINE PITCH, PLASTIC, LQFP-100
|
LEDtronics, Inc.
|
UPD78F0536GAR-9EV-A UPD78F0537GBT2-UEU-A |
8-BIT, FLASH, 20 MHz, MICROCONTROLLER, PQFP64 7 X 7 MM, LEAD FREE, FINE PITCH, PLASTIC, TQFP-64
|
|
PD70F3017YS2-17-YJC PD70F3017S2-17-YJC PD70F3015YG |
32-BIT, MROM, 17 MHz, RISC MICROCONTROLLER, PQFP100 14 X 14 MM, FINE PITCH, PLASTIC, LQFP-100 32 Bit RISC Microcontrollers(32位RISC微控制器) 32位RISC微控制器32位的RISC微控制器
|
NEC Corp. NEC, Corp.
|
18107 |
Fine Pitch Bump Adapters
|
Aries Electronics, Inc.
|
CPGA |
Ceramic Pin Grid Array Package
|
Amkor Technology
|
NP161-19604MF-G4-BF NP161-19604-G4-BF NP161-28902- |
Pin Grid Array / Zero Insertion Force (PGA / ZIF)
|
Yamaichi Electronics Co., Ltd.
|
NP236-102002-1 NP236-102002-2 |
Pin Grid Array /Zero Insertion Force (PGA/ZIF - Interstitial)
|
Yamaichi Electronics Co., Ltd.
|
|